MLVDS

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Drivers Per Package: / 1
ICC(Max)(mA): 20 24
ESD HBM(kV): 8kV
Package: 8-Pin SOIC 16-Pin TSSOP
Status

New Product

Production

Not Recommended in New Design

Drivers Per Package

/

1

Receivers Per Package

1

4

VCC(Min)(V)

3.0

VCC(Max)(V)

3.6

ICC(Max)(mA)

20

24

ESD HBM(kV)

8kV

IEC-61000-4-2 Contact

YES

Operating Temperature Range(℃)

-40 to +85

Package

8-Pin SOIC

16-Pin TSSOP

共3条数据

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Part Number Status Additional Features Drivers Per Package Receivers Per Package VCC(Min)(V) VCC(Max)(V) Data Rate(Max)(kBPS) ICC(Max)(mA) ESD HBM(kV) IEC-61000-4-2 Contact Operating Temperature Range(℃) Package
Part Number Status Additional Features Drivers Per Package Receivers Per Package VCC(Min)(V) VCC(Max)(V) Data Rate(Max)(kBPS) ICC(Max)(mA) ESD HBM(kV) IEC-61000-4-2 Contact Operating Temperature Range(℃) Package
TPT9H221 Production Half Duplex,MLVDS Type2 1 1 3.0 3.6 200,000 24 8kV YES -40 to +85 8-Pin SOIC
TPT9H111 Production Half Duplex,MLVDS Type1 1 1 3.0 3.6 100,000 24 8kV YES -40 to +85 8-Pin SOIC
TPT9L484 Production LVDS,4Rx / 4 3.0 3.6 400,000 20 8kV YES -40 to +85 16-Pin TSSOP
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